At an event in New York City today, Qualcomm unveiled its next generation chipset for the next wave of high-end Android devices: the Snapdragon 820.

The company had previously revealed details about the Adreno 530 GPU, Spectra ISP, and the modem it would be using on the chipset, but today it has provided more in-depth detail them.

The Snapdragon 820 chipset will make use of Qualcomm’s custom Kryo cores clocked at up to 2.2GHz. It will be paired with an Adreno 530 GPU that supports OpenGL ES 3.1+ and an Hexagon 680 DSP. The new DSP is significantly more powerful than the DSPs found on previous generation Qualcomm chipsets, while still being energy efficient. The DSP has been optimised for certain tasks that it can execute faster than the CPU while consuming less power. It also comes with an “always-on” low power sensor hub and ultra-low power imaging hub.

The chipset will also come with a new X12 LTE modem that supports LTE Cat. 12 for download speeds of up to 600Mbps, and LTE Cat. 13 for upload speeds of up to 150Mbps. It also features support for Wi-Fi 802.11ad and ac MIMO, and LTE-U that allows the chipset to access even unlicensed spectrum for even faster LTE speeds.

Other notable features of the chipset include support for Quick Charge 3.0, USB 3.0, Spectra ISP with support for 14-bit image sensors, hybrid autofocus, and multi-sensor fusion algorithms.

You can find the in-depth specifications of Qualcomm’s Snapdragon 820 chipset here.

With the Snapdragon 810 turning out to be a fiery mess for Qualcomm, expectations from the company’s first custom 64-bit processors are sky high. It will also be interesting to see how the Snapdragon 820 performs against Apple’s A9 chipset and Samsung’s upcoming Exynos 8890 chipset, which will also be the Korean giant’s first custom 64-bit chipset.